Samsung announces backside power delivery network breakthroughs – what does it mean for future chips?

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In: IT Infra

According to a report from TheElec and Samsung’s presentation at this year’s Very Large Scale Integration (VLSI) Symposium, the semiconductor manufacturer used new backside power delivery network (BS-PDN) approaches to successfully reduce the required wafer area by 14.8% when compared to traditional front side power delivery networks (PDNs).

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